FAQs - Windows Embedded CE 6.0 R3 BSP for the TI OMAP-L138/AM1808 based Hawkboard


FAQ answers


My new Hawkboard will not boot reliably. What is wrong?

This is a known issue with the latest Hawkboard hardware revision and is being investigated. Earlier versions of the Hawkboard hardware used an earlier OMAP-L138 silicon revision plus industrial spec parts for many components in the BOM which have now been populated with commercial spec parts in the latest shipping board revision.

Some of the most recent batch of Hawkboards appear to have operational stability issues as a result of these BOM changes straight from the factory which affect all OSes. MPC Data recommends that you contact your hardware supplier and check the Hawkboard Forums if your board exhibits boot issues.

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The OMAP-L138 CPU on the Hawboard runs hot to the touch. Is there a fix?

This is a known issue with the Hawkboard hardware which appears to be caused by the way that the [SW1] Boot Selection Logic is implemented in hardware. When the default NAND boot option is selected SW1-1 is ON which pulls VPIF_DOUT12 low however the CPU is still attempting to drive the PIN.

The latest release of the MPC Data BSP (V1.1) addresses the issue by modifying the PINMUX settings. The operational CPU temperature can also be reduced to normal in most cases by switching SW1-1 OFF once the board has booted successfully.

Remember to set SW1-1 to ON again each time you power cycle otherwise the board will not boot from NAND!.

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The SD Card is not detected when the write protect is on. Why is this?

This is a known issue and is being investigated. For now, you can only use an SD card with the write protect off.

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I have enabled the USB host or function driver, but it does not work. Is there something else I need to do?

Depending on the type of USB cable used, you may also need to set the Jumper JP1 to configure the USB direction. Check the Hawkboard documentation for details on this.

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Is there anything I can do to speed up the build?

In many cases, a full build is not required. In general, a full 'sysgen' is only required when adding or removing components from the catalog (i.e. changing the SYSGEN_* variables). When modifying components (i.e. BSP_* variables ) or code inside the BSP platform directory, you can usually get away with a 'Build BSP and Subprojects'. Finally, if just changing image configuration flags (i.e. IMG* variables), then a 'Make Run-time image' will often work. A good way to remember this is to be aware which type of variables (SYSGEN_*, BSP_*, IMG*) have changed, and see that the build type required matches these variable names.

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I get an error installing the SDK with Visual Studio 2008. Is there a workround?

Depending on the way that VS2008 and other Windows components are installed you can get an error at the end of the SDK install. Select a Custom Install and deselct the Documentation (which does not actually install anything anyway) then re-run the installer.

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How can I get access to the BSP releases?

Go to the MPC Data Support Portal: http://support.mpcdata.com/ti/. You can download the BSP for your particular hardware here. In addition if you register your hardware serial number you can access free support from MPC Data (conditions apply).

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What are the details of the customer support model provided?

Details of the customer support packages can be found on the MPC Data Support Portal: http://support.mpcdata.com/ti/

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PROFESSIONAL ENGINEERING SERVICES

TI selected MPC Data, Microsoft Embedded Gold Partner and Winner of 2008 and 2009 Microsoft Excellence Awards, to develop and test the Windows Embedded CE 6 BSP for the TI OMAP-L137/AM17xx EVM. With development teams in both EMEA and US we are recognised globally as industry experts in Windows Embedded CE product development and testing for our OEM clients.

ADDITIONAL RESOURCES

Windows Embedded CE Training from MPC Data:
http://www.mpc-data.co.uk/training/

More Information on Hawkboard:
http://Hawkboard.org/

Microsoft Windows Embedded CE 6.0 Pre-requisites– Visual Studio 2005 Trial, Platform Builder for Windows CE 6.0 (180 day evaluation version):
http://www.microsoft.com/windowsembedded/en-us/products/windowsce/getting-started.mspx

ABOUT MPC DATA

MPC Data helps embedded device makers worldwide get high-quality products to market faster, with lower risk and more cost effectively.

We offer services in software and hardware engineering from proof of concept to volume production, with a strong emphasis on embedded and real-time developments. With many years of experience in Windows Embedded, Embedded Linux and RTOSs, and thanks to its close partnerships with Microsoft and leading semiconductor vendors, MPC Data is the key partner for OEMs, offering consultation, software & hardware design, integration services, products and training.

For more information, please visit www.mpcdata.com or e-mail us at windows@mpcdata.com

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News

[January 30, 2012 - Version 1.3 of the Unified Windows Embedded CE6 and Compact 7 BSPs for the TI BeagleBoard and BeagleBoard-xM are available for download]

MPC Data - a Bsquare Company announces availability of version 1.3 of the unified BeagleBoard family Windows Embedded BSPs. The unified BSPs come with built-in support for both the original TI OMAP3530 based BeagleBoard and the latest DM3730 based BeagleBoard-xM. Existing customers of a previous version of the unified BSP will get the latest version as a free update through their myMPC account.